Chinese telecom equipment and terminal manufacturer Huawei Technologies has reportedly begun mass production of its "Kirin 970" handset chip, according to a source in the supply chain. Huawei plans to produce close to 40 mln of the Kirin 970 system-on-chip (SoC) altogether, which will make Huawei one of Taiwan Semiconductor Manufacturing Company's top five clients, said the source.
The Kirin 970 will upgrade to a 10 nm manufacturing process and increase its GPU performance, according to industry analyst Pan Jiutang. However, the Kirin 970 may continue to use the same Cortex-A73 architecture that is present in the Kirin 960. Other reports suggest that the Kirin 970 may leave the application framework unchanged and replace the Mali-G71 MP8 GPU with an MP12.