Unigroup to Invest RMB 100 Bln in Dongguan for 5G, IoT, SSD, Vehicle Chip R&D

Securities Times, 11/15/17

Tsinghua Unigroup, the Chinese state-backed private equity firm that focuses on investments in the technology industry in China, has signed a strategic partnership framework agreement with the Dongguan Municipal Government to invest RMB 100 bln in the construction of a Tsinghua Unigroup "Chip Cloud" industry city project and a "Tsinghua Unigroup Southern Headquarters" project. In the future, Tsinghua Unigroup plans to establish five major facilities in Dongguan, including a 5G technology research institute, a southern headquarters base, an SSD R&D business division, an IoT R&D and applications center, and a smart vehicle chip R&D applications base and sales center.

Keywords: hardware Dongguan 5G R&D Tsinghua Unigroup IoT wireless smart vehicle storage SSD

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